Samsung Semiconductor, Inc.

SPHWHAHDNE27YZU3DB

  • Manufacturer: Samsung Semiconductor
  • Package: Tray
  • Description: LED COB WHT LC016D 3500K 90CRI
  • RoHs Status:
SpecificationsProduct Description
Height 1.50mm
Color White, Warm
Lens Type Flat
Configuration Square
Type Chip On Board (COB)
Current - Test 450mA
Current - Max 900mA
Voltage - Forward (Vf) (Typ) 34V
Features -
Temperature - Test 85°C
Lumens/Watt @ Current - Test 137 lm/W
Wavelength -
Size / Dimension 19.00mm L x 19.00mm W
Viewing Angle 115°
Light Emitting Surface (LES) 14.50mm Dia
Luminous Flux @ Current/Temperature 2094lm (Typ)
Product Status Active
CRI (Color Rendering Index) 90
CCT (K) 3500K 3-Step MacAdam Ellipse
 
H-F3DTCG2T

1. Chart Outline DimensionsThe

unit

Unit

tolerance

Tolerance

Chip material

Die Material

Colloid

Lens color

Glowing color

Emitting color

mm

±0.2mm

Ingan

Green Diffused

Green

2. Optical parameters Photo Electricity Parameter

(Ambient temperature Ambient tempicureThe25℃ relative humidity HumidityTheRH 60%.

project

Item

symbol

Symbol

Test Conditions

Test Condition

Minimum

Min

Typical

Type

Maximum

Max

unit

Unit

Reverse current

Reverse Current

Ir

VR = 5V

/ /

/ /

10

μA

Forward Voltage

Forward Voltage

VF

If = 20mA

2.6

/ /

3.4

V

light intensity

Luminous intensity

IV

2200

3800

/ /

MCD

Main wavelength

Dominant wavelength

λD

520

/ /

530

NM

Halflight strong angle

Viewing angle

2θ1/2

/ /

30

/ /

DEG

Remarks: Brightness test tolerance ±15%, Wavelength test tolerance ±1NM, Test the front voltage test tolerance ±0.1V

Remark: The tolerance of intensity ±15%, The TOLARANCE of Wavelength ±1Nm, The TOLARANCE of FORWARDS VOLTAGE± 0.1v.Only Reference for Above when testing.

Third, extreme parameters Absolute maximum rating

(Ambient temperature Ambient tempicureThe25℃ relative humidity HumidityTheRH 60%.

project

Item

symbol

Symbol

Value

Value

unit

Unit

Remark

Remark

Positive current

Forward Current

If

25

ma

Peak front current current*

Peak FORWARD CURRENT*

IFP

50

ma

Power consumption

Power DISSIPATION

PD

100

MW

Working temperature

Operation Temperanture

TOPR

-40 to +85

Storage temperature

Storage Temperanture

TSTG

-40 to +85

Welding temperature

Soldering Temperanture

TSOL

260±5

Less than 5 Second

*Note: pulse width ≤0.1ms, Occupy a duty ratio ≤1/10 *Note: Pulse width0.1ms, duty1/10

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